Verification of Cleaning under Leadless ComponentsAuthors: Flavius Dehel and Ishrat Hasan
Company: Creation Technologies
Date Published: 5/19/2015 Conference: ICSR (Soldering and Reliability)
This paper will discuss some of the work done by the author for the development and qualification of the process for reliable and effective cleaning of flux residues under low standoff components and a method for the verification of cleanliness to establish repeatability and reliability.
The paper covers the work on:
OA (Organic Acid) Solder Paste, Residues, LGA (Land Grid Array), QFN (Quad Flat No-Leads Package), BGA (Ball Grid Array), Cleanliness, Low Standoff, DI (Deionized) Water, Saponifier
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