ICSR (Soldering and Reliability) Conference Proceedings


Verification of Cleaning under Leadless Components

Authors: Flavius Dehel and Ishrat Hasan
Company: Creation Technologies
Date Published: 5/19/2015   Conference: ICSR (Soldering and Reliability)


Abstract: The miniaturization of electronic devices continues the challenge for assembly equipment and processes to stay in compliance and current with newer packages. The use of fine-pitched and low standoff components, and the requirement of circuit board assemblies free of ionic contaminants is an ever-increasing challenge for the manufacturing process, especially during the cleaning stage. It is important that a robust washing process be established and a process control be maintained for ensuring total flux removal through reliable cleaning.

This paper will discuss some of the work done by the author for the development and qualification of the process for reliable and effective cleaning of flux residues under low standoff components and a method for the verification of cleanliness to establish repeatability and reliability.

The paper covers the work on:

  • The methods of removing water-soluble solder paste residue under low standoff components and achieving a reliable cleaning process
  • Method of cleanliness verification
  • Factors that may affect cleanliness

  • Key Words: 

    OA (Organic Acid) Solder Paste, Residues, LGA (Land Grid Array), QFN (Quad Flat No-Leads Package), BGA (Ball Grid Array), Cleanliness, Low Standoff, DI (Deionized) Water, Saponifier



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