ICSR (Soldering and Reliability) Conference Proceedings

The Development of a 0.3mm Pitch CSP Assembly Process Part 1: Stencil Printing Considerations

Authors: Jeff Schake and Mark Whitmore
Company: DEK Printing Solutions, ASM Assembly Systems
Date Published: 5/19/2015   Conference: ICSR (Soldering and Reliability)

Abstract: With shrinking component technology the stencil printing process is becoming increasingly challenged. Not only do long established design rules need to be broken to accommodate finer pitches, but print quality and consistency of print are becoming even more critical in delivering a high yield assembly process.

A major body of work has been undertaken looking at several different aspects of the stencil printing process and their impact upon the assembly (and ultimate reliability) of 0.3mm pitch CSP components.

For the study described here, a systematic approach was taken. In the first instance, factors concerning the stencil printing process were considered with key learnings then applied to the assembly of actual components.

In Part 1, stencil printing factors such as aperture design (circles, rotated squares), aperture size (140 microns thru 200 microns) and printing technology (standard squeegees, active squeegees) were investigated. Full details with regards to the results and data analysis are presented together with conclusions.

Data from subsequent assembly trials and reliability testing will be presented in Part 2, which will be published later during 2015.

Key Words: 

Printing, stencil, aperture, area ratio, 0.3mm pitch, chip scale package, heterogeneous, fine pitch, transfer efficiency, miniaturization

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