Surface Mount International Conference Proceedings


FINE PITCH BGA PACKAGE ASSEMBLY

Author: Barry Miles
Company: Amkor Technology
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Portable products are currently driving the market toward thinner, lighter, and higher density IC packages. A review of small form factor products, which are shipping in high volumes, reveals that chip size packages (CSPs) are beginning to make their way into production applications[l]. To meet this need, Amkor Technology has developed two near CSP options, ChipArray” BGA and jZeXBGA@. Both packages utilize a die up, wire bonded, overmolded configuration. Reduced ball pitches (1.0 mm and below) and lower mounted heights, combined with the ability to mount these package types using the existing surface mount technology infrastructure, make these package options ideal for portable products, particularly for the wireless communications and camcorder markets. These packaging options offer the routing capability to reach pitches of 0.5 mm for I/O counts less than 200, which is essential for the CSP or near CSP applications that the market is demanding [ 21. This paper outlines the key features, substrate design rules, and assembly processes for these packages.



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