ICSR (Soldering and Reliability) Conference Proceedings

Case Study - Head in Pillow Defect on a Plastic Ball Grid Array

Authors: Henry Rekers, P. Eng.
Company: Schneider Electric
Date Published: 5/19/2015   Conference: ICSR (Soldering and Reliability)

Abstract: This paper describes a particular incident which occurred on a 360 pin, 1.27mm pitch plastic ball grid array (PBGA or BGA). Early on in our use of this part, we received reports of intermittent field failures. The failure was described as a “blank screen” or “dead on arrival” defect, meaning there was no functionality in the product. The Root Cause Analysis (RCA) department confirmed this defect but reported that they could make the product “boot up” by putting pressure on the processor (the part that this study focuses on). Analysis and inspection led us to the corner connections on the part. This paper describes this analysis, reports on the findings and makes specific recommendations on how to avoid this defect in the future.

Key Words: 

Ball Grid Array, Head in Pillow, Reliability, Field Failures

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