Surface Mount International Conference Proceedings


Author: Michael K. Neilsen
Company: Sandia National Laboratories
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: The near eutectic 60Sn-40Pb alloy is one of the most commonly used solder for electrical interconnections in electronic packages. This alloy has a number of processing advantages (suitable melting point of 183°C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic constitutive model for solder with an internal state variable that tracks microstructural evolution is currently under development. This constitutive model was implemented into several finite element codes. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a ball grid array (BGA) solder interconnect. BGAs with both homogeneous and heterogeneous initial microstructures were evaluated. In this paper, the constitutive model used to describe the solder will first be briefly discussed. The results of computational studies to determine the thermomechanical response of BGA solder interconnects will then be presented. Keywords: BGA, Finite Element Analysis, 60Sn-40Pb Solder, Microstructure

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819