Cool Substrate for 2.5D PackagesAuthors: Charles Lin, Ph.D., Nick Wang, Jerry Tan
Company: Bridge Semiconductor Corporation
Date Published: 4/14/2015 Conference: Symposium
This paper will describe a scalable 2.5D solution using a substrate having interposer or chip carrier integrated therein. Not only conventional silicon interposer, other types of chip carrier such as organic, glass, and ceramic interposer can also be integrated with the organic laminate depending on cost and routing density requirements. The organic laminate in this integrated substrate is a buildup layers without a core. By using a smart combination of interposer and buildup layers manufacturing processes, this integrated substrate allows a very high pin-count and high performance flip chip assembly without incurring any expensive new equipment and new tooling. The integrated substrate, namely, Carrieron- Organic-Laminate (COOL) can support other benefits such as allowing package-on-package assembly will be addressed as well.
flip chip packaging, coreless substrate, interposer, 2.5D, 3D, FO-WLP (fan-out wafer level packaging), POP (package-on-package), embedded die
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