SMT Soldering with Low Temperature Solder PasteAuthors: Tang Kok Kwan, Raiyo F. Aspandiar, Scott Mokler, Olivia Chen, Art Jiang
Company: Intel Corporation
Date Published: 4/14/2015 Conference: Symposium
In this study, we explored SMT soldering with low temperature solder paste consisting of Bi-Sn-Ag or Sn-Bi alloy, reducing the soldering peak temperature to ~180°C vs. ~240°C of Lead Free process that use SnAgCu (SAC) solder paste. Solder alloys of Bi-Sn-Ag or eutectic Sn-Bi composition melt at about ~138°C. Although the peak reflow temperatures significantly reduces the high temperature warpage on FCBGA components and improves the SMT yield, Bi which has been previously proven to contribute to brittleness of solder joint, and significantly reduce the mechanical stress performance of solder joints [1, 2, 3].
This paper describes the yield improvements, defect mechanisms, reliability performance and potential cost saving in soldering with low temperature Bi-Sn-Ag solder pastes.
Low temperature soldering, low temperature solder paste, SnBiAg, SnBi
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