SMTA China Conference Proceedings

Solder Paste Residue Corrosivity Assessment: Bono Test

Authors: Celine Puechagut, Anne-Marie Laiigt, Emmanuelle Guene, Richard Anisko (presented by Steven Teh)
Company: Inventec Performance Chemicals
Date Published: 4/22/2014   Conference: SMTA China

Abstract: This paper is in English and Chinese languages.

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-004 corrosion tests: copper mirror, copper panel corrosion test, Surface Insulation Resistance (SIR) and Elecrochemical Migration (ECM). Other SIR and ECM tests are described in Bellcore GR-78-CORE and JIS Z3197 standards. Although SIR and ECM tests are recognized by all standards authorities to evaluate the solder paste residue corrosivity after reflow, a more selective method, the Bono test, has been developed and implemented in some French companies as a qualification criterion. It has been proven that compared to common corrosion tests, the Bono test better differentiates the nature of solder paste residues.

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