SMTA China Conference Proceedings


Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality

Authors: Colin Wang, Wu Jin Chang, Wang Xin, Tang Kok Kwan, Raiyo F. Aspandiar
Company: Quanta and Intel Corporation
Date Published: 4/22/2014   Conference: SMTA China


Abstract: This paper is in English and Chinese languages.

Reacting to increased silver metal costs in recent years, Personal Computer (PC) board assemblers are converting to low Ag SAC solder pastes, transitioning away from widely used SAC305 (Sn - 3.0wt%Ag 0.5wt% Cu). Previous industry studies demonstrated similarities between low Ag SAC and SAC305 solder paste in printability, slump, solder balling and voiding. However, no data has been published on the effect of using low Ag SAC solder paste on solder joints quality. Solder paste property (flux composition and solder powder metallurgy) is the major determinant of solder joint defects such as head-on-pillow (HoP), non-wet open (NWO) and solder ball bridging (SBB) defects. This study discusses the results of two distinct experimental evaluations with low Ag SAC solder pastes.

Key Words: 

Low Ag SAC Solder Paste, Low Ag soldering, Low Ag reflow



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