NxTGen PoP (Shrinking the Package-on-Package)Authors: Jim Adriance, John Almiranez, and Peng Ji
Company: Universal Instruments Corporation
Date Published: 4/22/2014 Conference: SMTA China
It has been more than five years when the first generation of Package-an-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property thus shrinking the overall package. However, it is known fact that even with this 3D assembly technology, the demand for continuous higher functionality and smaller form factor is ever present.
In discussing about the continuing shrinking form factor, active and passive components are becoming part of the substrate thus further reducing the height of the package. All of these are going to be discussed and presented here including the most economical advanced packaging assembly technique.
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