SMTA China Conference Proceedings


Jetting Solder Paste Opens Up New Possibilities in Your SMT Production

Author: Nico Coenen (presented by Sam Zhao)
Company: Micronic MYDATA
Date Published: 4/22/2014   Conference: SMTA China


Abstract: This paper is in English language only.

Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advantages compared to standard screen printing or dispensing. The challenges of today's production environment is not only the fact that components getting smaller but the biggest challenge is the combination of small and large components on the same board. Putting the right amount of solder paste for each component will be required to deliver the right quality. Depending on the volume requirements Jet Printing can be an alternative tool to cope with this mix or be used as an add on tool to compliment the screen printer in a high volume environment. The Jet Printing technology allows to build up the volume by single dots to achieve the right amount for each component. Special applications like pin in paste, applying paste in cavities and many more challenges of today's requirement can be easily accommodated with this technology.

Mixing different types of solder paste with different metal content will be discussed as typically jet printing paste is type 5 versus type 3 or 4 for a screen printer.

The differences between jet printing en dispensing will be highlighted and technical challenges with broad band technology will be discussed.

Key Words: 

Jet Printing, Broadband Technology, Solder Paste, Jetting



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