Use of Non Etching Adhesion Promoters in Advanced PCB ApplicationsAuthors: Roger Massey and Adrian Zee
Company: Atotech Deutschland GmbH
Date Published: 10/24/2010 Conference: SMTA International
While the improved adhesion to a wide range of materials is of great interest, it is not the only advantage offered through the use of non etching adhesion technologies. At high operating frequencies, the surface roughness that is characteristic of etch based adhesion promoters leads to increased signal loss. Through the use of Non Etching Adhesion Promoters (NEAP) a smooth track profile can be created which offers an enhanced signal transmission characteristic which is of critical importance when developing the next generation of electrical circuitry.
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume manufacturing and its performance is reported through short and long term reliability testing. The work described shows that NEAP processes currently available on the market are viable alternatives over existing etch based adhesion technologies and offer increased adhesion to a wider range of materials, plus the added benefit of enhanced signal transmission in high frequency applications.
non-etching adhesion promoter, NEAP, adhesion, soldermask, signal loss, high frequency
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