Applications of Solder Fortification with PreformsAuthors: Carol Gowans and Ronald C. Lasky, Ph.D., P.E.
Company: Indium Corporation and Dartmouth College
Date Published: 10/24/2010 Conference: SMTA International
To satisfy the above need, solder performs were developed. These pre-formed pieces of solder typically come in the same sizes as 0402, 0603, and 0805 passive components. The solder preforms are placed by the component placement machines onto the solder deposit. This additional solder assures that an adequate solder joint is formed with a minimum of solder paste and its residual flux.
Although PIP was an early application of solder preforms, more recently other “solder starved” applications have emerged, such as radio frequency (RF) shields and connectors. In addition, the use of ultra thin stencils in the assembly of miniaturized components can result in other components being solder starved. These applications are all candidates for solder performs.
This paper will cover the design and assembly techniques for using solder performs for “solder fortification”. Several successful applications will be presented. In some of these applications, defects were reduced by 95% after implementing solder performs.
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