SMTA International Conference Proceedings

Supporting Component Self-Alignment by Forced Oscillation During Reflow Soldering

Authors: Florian Schüßler, Michael Pfeffer, Stefan Härter, and Prof. Dr.-Ing. Jörg Franke
Company: University Erlangen-Nuremberg
Date Published: 10/24/2010   Conference: SMTA International

Abstract: From printed circuit board manufacturing and stencil printing to component assembly all single processes of the surface mount technology are more or less afflicted with tolerances. Even if each of the single deviations might not be critical for the yield of production, cumulative tolerances of the whole process chain can lead to failures during soldering like tombstoning, misaligned components or irregular solder joints. With proceeding miniaturization tolerances become even more critical. One effect that helps to compensate deviations is the self-centering of electronic components during the reflow soldering process. This effect is beside others especially dependent on the wetting forces, which again depend on various factors like grade of oxidation or surface finish.

In this paper we will present how forced oscillation of printed circuit boards can support the self-alignment of electronic components during reflow soldering. Therefore several principles for the generation of the oscillation like piezo-actuators or electro-magnetic actuators were analyzed and evaluated. On the basis of a work piece carrier with an integrated actuator we have determined the influences of the factors amplitude, frequency and duration of the oscillation on the self-centering of components of different sizes. To validate each parameter´s influence on the self-alignment the exact position of components was measured before and after reflow soldering. Those results were compared to components soldered without vibration during reflow process. Thus we can characterize the influence of vibration on the self-alignment in dependence of oscillation parameters, component orientation and size as well as the used surface finishes (ENIG, OSP, immersion tin). Additionally, we will present concepts for the integration of oscillation into a reflow soldering oven for the given parameters.

Key Words: 

soldering, oscillation, self-alignment

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