Supporting Component Self-Alignment by Forced Oscillation During Reflow SolderingAuthors: Florian Schüßler, Michael Pfeffer, Stefan Härter, and Prof. Dr.-Ing. Jörg Franke
Company: University Erlangen-Nuremberg
Date Published: 10/24/2010 Conference: SMTA International
In this paper we will present how forced oscillation of printed circuit boards can support the self-alignment of electronic components during reflow soldering. Therefore several principles for the generation of the oscillation like piezo-actuators or electro-magnetic actuators were analyzed and evaluated. On the basis of a work piece carrier with an integrated actuator we have determined the influences of the factors amplitude, frequency and duration of the oscillation on the self-centering of components of different sizes. To validate each parameter´s influence on the self-alignment the exact position of components was measured before and after reflow soldering. Those results were compared to components soldered without vibration during reflow process. Thus we can characterize the influence of vibration on the self-alignment in dependence of oscillation parameters, component orientation and size as well as the used surface finishes (ENIG, OSP, immersion tin). Additionally, we will present concepts for the integration of oscillation into a reflow soldering oven for the given parameters.
soldering, oscillation, self-alignment
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