ASSEMBLY-LEVEL RELIABILITY OF FLEX-SUBSTRATE BGA, LASTOMER-ON-FLEX PACKAGES AND 0.5mm PITCH PARTIAL ARRAY PACKAGES
Author: Pradeep Lall Company: MOTOROLA Date Published: 8/23/1998
Surface Mount International
Abstract: The assembly-level reliability of the 0.8 mm pitch Flex-Substrate BGA, 0.65 mm pitch Elastomer-on-Flex Package, and 0.5mm pitch partial array BGA has been characterized in thermal fatigue, out-of-plane deformation, low frequency repeated bending, and thermal aging. Non-linear finite element models have been used to identify and predict the dominant failure mechanisms and identify the assembly parameters which have a dominant impact on reliability. The model predictions have been verified with accelerated test data. The results have been bench-marked against other technologies including 1.5 mm pitch OMPAC™ and 1 mm pitch, 196 I/O Glob-top BGA.