Surface Mount International Conference Proceedings


APPLICATION ADVANTAGES OF INTEGRATED PASSIVE DEVICES (IPDs) IN CHIP SCALE PACKAGES

Author: Satish Kumar
Company: Microelectronics Components
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Many products, such as cell phones contain very large number of passive components. The makers of these products are seeking size and cost reduction by moving from the expense of mounting discrete passive components to the use of integrated clusters, called IPD’s or Integrated Passive Devices. A typical IPD may contain 8 to 36 resistors, capacitors and diode circuit combinations. Future IPD’s will further provide smaller size and lower cost through the use of wafer-level chip scale packaging, (CSP).

This paper will discuss the application advantages and show current examples of IPDs in CSPs.

Keywords: Passives, resistors, capacitors, diodes, chip scale packaging, integrated passives, passive devices.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819