APPLICATION ADVANTAGES OF INTEGRATED PASSIVE DEVICES (IPDs) IN CHIP SCALE PACKAGESAuthor: Satish Kumar
Company: Microelectronics Components
Date Published: 8/23/1998 Conference: Surface Mount International
This paper will discuss the application advantages and show current examples of IPDs in CSPs.
Keywords: Passives, resistors, capacitors, diodes, chip scale packaging, integrated passives, passive devices.
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