Heatsink Adhesive Bonding InvestigationAuthors: Smile Ling, Jim Bielick, Michk Huang, Wayne Zhang, Blue Wang, Xiaoyun Xia and Divas Liu
Company: IBM Corporation and Foxconn
Date Published: 4/17/2013 Conference: Symposium
The conclusion from this paper will show how heatsink surface, pre-cure application force, load dwell time, activator contact time before weight application, adhesive pattern, and rework temperature influence heatsink performance after assembly.
Heatsink adhesive, Key factor, Heatsink surface, Bonding process, Rework temperature
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