Cleaning Flux Residue Under Bottom Termination Components in Batch Spray-In-Air ToolsAuthors: Mike Bixenman, Chelsea Jewell, Kevin Soucy, Jan Declercq and Jason Chan
Company: Kyzen Corporation
Date Published: 4/17/2013 Conference: Symposium
Numerous factors must be considered when engineering a cleaning process that is capable of removing flux residues from under Bottom Termination Components. Four key factors to an ideal cleaning condition are (1) PCB Board Design, (2) Solder Paste / Flux Selection, (3) Cleaning Agent Selection, and (4) Cleaning Machine Selection.
The purpose of this research study is to evaluate the cleanability of low residue flux residues under Bottom Termination Components in batch spray in air cleaning tools. The study will report flux removal efficiency of aqueous cleaning agents in various batch cleaning tools. From the data findings, inferences will be made as to the important features that provide a wide cleaning process window.
Electronic Assembly Cleaning, Design for Cleaning, Batch Cleaning Machines, Cleaning under BTCs, Z-Axis
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