Optimizing Solder Paste for Void Minimization With Vacuum Reflow
Authors: Keith Sweatman, Takashi Nozu, Tetsuro Nishimura Company: Nihon Superior Co., Ltd Date Published: 4/17/2013
Abstract: While a significant level of voiding can be tolerated in solder joints where electrical connectivity is the main requirement, in the increasingly common applications where the joint plays a critical role in heat transfer from high power devices it is important that the incidence of voiding is at an absolute minimum. Vacuum reflow is being recognized as a way of removing voids from solder joints but by itself cannot ensure a void-free solder joint. In this paper the authors report on the optimization of the solder paste formulation and the reflow profile to ensure that vacuum reflow can achieve its full potential in removing voids from solder joints.