Jetting Solder Paste Opens Up New Possibilities in Your SMT ProductionAuthor: Nico Coenen
Date Published: 4/17/2013 Conference: Symposium
The Jet Printing technology allows to build up the volume by single dots to achieve the right amount for each component. Special applications like pin in paste, applying paste in cavities and many more challenges of today’s requirement can be easily accommodated with this technology.
Mixing different types of solder paste with different metal content will be discussed as typically jet printing paste is type 5 versus type 3 or 4 for a screen printer. The differences between jet printing en dispensing will be highlighted and technical challenges with broad band technology will be discussed.
Jet Printing, Broadband Technology, Solder Paste, Jetting
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