Surface Mount International Conference Proceedings


MINIMIZING ESD EFFECTS OF LABELING IN THE ELECTRONICS ASSEMBLY ENVIRONMENT

Author: Viclci Heideman
Company: Brady USA
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Electrostatic discharge (ESD) can cripple or destroy sensitive printed circuit boards (PCBS) and electronic components. Repair and replacement can often amount to 100 times the original cost. In their quest to reduce these expenses, electronics manufacturers are interested in cost-effective and efficient ways to eliminate static generating materials from the production floor. One of the many potential sources for ESD is standard PCB and component bar code labels that enable manufacturers to trace work in process (lVIP) and provide long-term records of production, repair and warranty information. Standard labels (see figure 1) very prevalent in electronics assembly areas, utilize insulative materials that could generate up to 1000 volts when removed from the release liner. Recently, labels have been introduced to the marketplace which reduce the amount of voltage remaining on the label to a level considered safe to most electronic components. Static dissipative materials allow the charge to quickly spread through the adhesive layer to ground.



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