Kirkendall Voiding in 2.5/3D Assembly MicrojointsAuthors: F. Batieha, F. Feyissa, S. Hamasha, S. Shirazi, L. Wentlent, P. Ogutu, N. Dimitrov, E. Fey, and P. Borgesen
Company: Binghamton University (SUNY)
Date Published: 9/18/2014 Conference: Medical Electronics Symposium
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.