IWLPC (Wafer-Level Packaging) Conference Proceedings


Enabling Wearable Electronics: Innovation through Miniaturization

Authors: Ted Tessier and Kazu Itoi
Company: FlipChip International and Fujikura Limited
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)


Abstract: This download just includes the slides of Mr. Tessier's presentation. There is no technical paper.



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