IWLPC (Wafer-Level Packaging) Conference Proceedings


Endoscopes Gain from 3D Assembly and Meticulous Process Control

Author: Phil Marcoux
Company: Promex Industries
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Endoscopes are widely used in the medical field for viewing confined areas. Traditional endoscopes employ one camera and light source because of the size limitations of the image sensor and the light source.

In recent years there have been many advances in multi-chip stacked assembly, wafer level package image sensors and smaller high intensity light sources. These advances not only make single camera scopes smaller and less invasive, but they enable the production of multi-camera systems for even greater versatility and viewing accuracy. Multicamera scopes can enable 3D viewing of the objects in the confined area as well as the ability to view objects with different light filters.

Stacked IC packaging provides one of the means to increase the circuit density and functionality and enable the production of a multi-camera scope.

Key Words: 

Medical Electronics, Stacked Assembly, 3D, 2.5D, Endoscopes



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