Endoscopes Gain from 3D Assembly and Meticulous Process ControlAuthor: Phil Marcoux
Company: Promex Industries
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
In recent years there have been many advances in multi-chip stacked assembly, wafer level package image sensors and smaller high intensity light sources. These advances not only make single camera scopes smaller and less invasive, but they enable the production of multi-camera systems for even greater versatility and viewing accuracy. Multicamera scopes can enable 3D viewing of the objects in the confined area as well as the ability to view objects with different light filters.
Stacked IC packaging provides one of the means to increase the circuit density and functionality and enable the production of a multi-camera scope.
Medical Electronics, Stacked Assembly, 3D, 2.5D, Endoscopes
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