IWLPC (Wafer-Level Packaging) Conference Proceedings

The Advanced Monitoring of Organic Additives in Copper Electroplating Baths

Authors: Michael Pavlov, Eugene Shalyt, Isaak Tsimberg, Danni Lin, and Peter Bratin
Company: ECI Technology
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)

Abstract: As copper plated features in semiconductors continue to decrease in size, it is increasingly critical to their manufacturers to receive the most accurate information about the composition of plating solutions. With miniaturization of plating features, the modern plating chemistries are also being modified to provide defect-free filling. These modifications typically affect organic additive systems, while the inorganic components remain the same with an option of concentration change. For appropriate control of the plating bath, some organic additive systems require analysis of multiple individual components. Typical plating composition includes three organic additives commonly named Suppressor, Accelerator, and Leveler. In this testing, four organic components system have been analyzed. This article focuses on novel approaches in electrochemical analysis of copper plating solutions used in Wafer Level Packaging (WLP). Results obtained for four organic additives are reported.

Key Words: 

Electroplating, Copper, Analysis

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