IWLPC (Wafer-Level Packaging) Conference Proceedings


Flexline™ - A Universal Wafer-Level Packaging Platform for Fan-In and Fan-Out Designs

Authors: Rajendra D. Pendse, Ph.D.
Company: STATS ChipPAC Inc
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)


Abstract: A new flexible manufacturing methodology has been developed that provides a seamless bridge between the manufacture of fan-in and fan-out wafer level package designs while retaining the same fundamental process flow and materials. The fan-out packages produced (trade named eWLB for embedded wafer level ball grid array) provide a superior alternative to traditional leadframe- and substratebased packaging and have received broad industry adoption. The fan-in configuration produced with this methodology, known as eWLCSP™ for encapsulated Wafer Level Chip Scale Package, is relatively new and unique in the industry, providing a superior alternative and drop-in replacement for the traditional WLCSP package.

In this paper, we review the new flexible manufacturing methodology, the attributes of the resulting fan-out and fanin package architectures, and more notably, the features of the new fan-in package known as encapsulated WLCSP or eWLCSP™. We also present the exceptional scaling of density, form factor and cost that is made possible by this packaging approach. Finally, we review the future avenues for further expanding the scale and cost of the manufacturing process.

Key Words: 

eWLB, fan-out, eWLCSP, fan-in, wafer level package, reconstitution, FlexLine



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819