Flexline™ - A Universal Wafer-Level Packaging Platform for Fan-In and Fan-Out DesignsAuthors: Rajendra D. Pendse, Ph.D.
Company: STATS ChipPAC Inc
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
In this paper, we review the new flexible manufacturing methodology, the attributes of the resulting fan-out and fanin package architectures, and more notably, the features of the new fan-in package known as encapsulated WLCSP or eWLCSP™. We also present the exceptional scaling of density, form factor and cost that is made possible by this packaging approach. Finally, we review the future avenues for further expanding the scale and cost of the manufacturing process.
eWLB, fan-out, eWLCSP, fan-in, wafer level package, reconstitution, FlexLine
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.