IWLPC (Wafer-Level Packaging) Conference Proceedings

The Optimization of MEMS through the Development of Generic Manufacturing Platforms

Authors: A. Rouzaud, JP. Polizzi, Ph. Robert, J. Arcamone
Company: CEA, LETI, MINATEC Campus
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Since the first paper considering silicon as a structural material [1], MEMS have gained a considerable attractiveness, first in niche markets (aerospace, military), then in automotive (airbag triggering systems, and later roll-over control) and consumer industry (MEMS accelerometers and gyrometers in game consoles and mobile phones). Today they show a pervasive use in all markets sectors (industry, medical, environment…). This noteworthy development explains the high growth already observed in the multi billion dollar MEMS industry (~12B US$ in 2013) and the associated impressive annual CAGR (~12.7 %) forecast for the next few years [2]. During this past period of expansion, MEMS manufacturing technologies have undergone several changes starting with the 80's bulk micromachining technologies, moving to surface micromachining technologies in the 90's, then to SOI MEMS micromachining technologies in the 00's. Coming now at the time of technical maturity, and in a context of ambitious initiatives such as Internet of Things [3],[4] or Trillions sensors vision [5], MEMS industry is now requiring more standardization in manufacturing processes, and several initiatives are in preparation in the main R&D labs worldwide. This paper presents Leti’s contribution to develop generic platforms matching the suitable MEMS technologies with different applications. Given the different levels of maturity between physical and chemical sensors, two specific approaches have been considered and Leti has today implemented two different platforms.

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