IWLPC (Wafer-Level Packaging) Conference Proceedings

Recent Advances in Die Attach Film

Authors: Frederick Lo, Richard Amigh, and Kevin Chung
Company: AI Technology, Inc.
Date Published: 11/11/2014   Conference: IWLPC (Wafer-Level Packaging)

Abstract: The advantage of using die attach film at the wafer level compared to using die attach material on individual die are known for many years. To completely take advantage of the use of die attach film at the wafer level, the die attach film has to be optimized to account for various process conditions that the film has to successfully pass through without degradation in any of its end use properties of adhesion strength and thermal and electrical properties.

More recently, the demand for hand held devices has led to more advanced technologies in 2.5D and 3D packaging and in the handling of extremely thin wafers and dies. The material supply industry has responded in providing newer generations of die attach films and wafer protection material to these increasingly demanding challenges.

In this paper, we will examine the criteria for higher efficiency, more reliability and higher performance die attach film at the wafer level.

We will also examine the effects of interconnection from chip to package on the choice of die-attach solutions. The packaging using wire-bonding, flip-chip soldering or the direct mechanical contact attach from flip-chip to bond pads effectively dictates the choice of different wafer level die attach solutions.

Key Words: 

Die attach, wafer level, optimization

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