Recent Advances in Die Attach FilmAuthors: Frederick Lo, Richard Amigh, and Kevin Chung
Company: AI Technology, Inc.
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
More recently, the demand for hand held devices has led to more advanced technologies in 2.5D and 3D packaging and in the handling of extremely thin wafers and dies. The material supply industry has responded in providing newer generations of die attach films and wafer protection material to these increasingly demanding challenges.
In this paper, we will examine the criteria for higher efficiency, more reliability and higher performance die attach film at the wafer level.
We will also examine the effects of interconnection from chip to package on the choice of die-attach solutions. The packaging using wire-bonding, flip-chip soldering or the direct mechanical contact attach from flip-chip to bond pads effectively dictates the choice of different wafer level die attach solutions.
Die attach, wafer level, optimization
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