NCP Versus NCF for Thermocompression MEMS Bonding Using Gold Stud BumpsAuthors: Maaike M. Visser Taklo, Astrid-Sofie Vardøy, Alastair Attard, Zlatko Hajdarevic, Stephan Bulacher, Mario Saliba, Jan Wijgaerts, Joshua Borg, David Oscar Vella
Company: SINTEF, Besi Austria GmbH, Henkel Electronics Materials, STMicroelectronics Malta
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
Bonding parameters were optimized and varied systematically individually for each adhesive. Two types of bumps (called Standard and AccuBumps™) were tested for the NCP whereas only AccuBumps™ were tested for the NCF. Results of visual inspection, shear testing and inspections of cross sections with scanning electron microscopy and energy dispersive X-ray spectroscopy were compared for the two types of adhesives. Satisfactory assembly results were achieved for both adhesives; based on these results a final selection of NCP or NCF seems to remain a question of cost efficiencies of the different process flows.
MEMS, interconnects, thermocompression, gold, stud bump, non-conductive paste, non-conductive film
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