Temporary Bonding on the Move Towards High Volume: A Status Update on Cost-of-OwnershipAuthors: Thomas Uhrmann, Jürgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger and Paul Lindner
Company: EV Group
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
The temporary bonding process yield has a major impact on the overall Cost of Ownership (CoO). On the other hand, throughput of the individual process steps like spin coating, bonding, cure, debonding and cleaning processes is the second determining factor for improved CoO. This paper should provide in depth understanding of CoO contributors to temporary bonding and debonding. Focus is put on the cost sensitivity of the major influencing contributor to temporary bond as well as debonding.
Temporary bonding, Debonding, Cost-of-Ownership, CoO, 3DIC
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