Surface Mount International Conference Proceedings


LIMITS OF COPPER PLATING IN HIGH ASPECT RATIO MICROVIAS

Author: Dennis Fritz
Company: MacDermid
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: The production of Build Up Multilayer printed circuit boards has generated enormous effort recently around the world. Not only is this session, but whole conferences are now being held on this technology.

Several techniques are capable of producing microvias:  Photolithography -where the vias are created by the action of the developer solution on the dielectric  Plasma - where holes are etched in copper foil and the action of the plasma removes exposed dielectric  Mechanical - where dielectric is drilled or sand blasted away  Laser - using ablation to remove both the copper and the dielectric, or just the organics when “deposited dielectric” construction is used

All of these techniques next require the metallization of the via walls to make a conductive interconnect between layers of circuitry.

This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.



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