LIMITS OF COPPER PLATING IN HIGH ASPECT RATIO MICROVIASAuthor: Dennis Fritz
Date Published: 8/23/1998 Conference: Surface Mount International
Several techniques are capable of producing microvias: Photolithography -where the vias are created by the action of the developer solution on the dielectric Plasma - where holes are etched in copper foil and the action of the plasma removes exposed dielectric Mechanical - where dielectric is drilled or sand blasted away Laser - using ablation to remove both the copper and the dielectric, or just the organics when “deposited dielectric” construction is used
All of these techniques next require the metallization of the via walls to make a conductive interconnect between layers of circuitry.
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.