OEE and Production Yield Improvements on WLCSP Devices: Case Study Using A Novel Probe DesignAuthor: Ranauld Perez
Company: Johnstech International
Date Published: 11/11/2014 Conference: IWLPC (Wafer-Level Packaging)
The purpose of this paper is to share and provide some insights regarding final wafer level testing of high volume audio SOC that has been released for commercial use. The focus will be on key test parameters that could be affected by wafer probe configuration and possible innovative improvements to meet production test yield and OEE expectations.
WLCSP, mixed signal SOC, OEE, Wafer Probe
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