SMTA International Conference Proceedings

Thick Copper PCBA Technology & Process Development

Authors: Dennis Willie, Richard Loi, and David Geiger
Company: Flextronics
Date Published: 9/28/2014   Conference: SMTA International

Abstract: Soldering Plated Through Hole (PTH) components on thick multi-layers Print Circuit Boards (PCB) has always been a challenge in manufacturing for both manual and wave soldering processes, especially from a vertical solder hole fill aspect. With customer designs demanding thick copper inner layers to carry more electrical current, soldering becomes more challenging than ever. This paper evaluates and presents critical design variables in thick, heavy copper Print Circuit Boards (PCB) that help to improve PTH hole-fill for lead-free wave soldering process.

Key Words: 

Thick Cu, lead-free, through-hole component, wave soldering, process optimization, SnAgCu

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819