SMTA International Conference Proceedings


Thick Copper PCBA Technology & Process Development

Authors: Dennis Willie, Richard Loi, and David Geiger
Company: Flextronics
Date Published: 9/28/2014   Conference: SMTA International


Abstract: Soldering Plated Through Hole (PTH) components on thick multi-layers Print Circuit Boards (PCB) has always been a challenge in manufacturing for both manual and wave soldering processes, especially from a vertical solder hole fill aspect. With customer designs demanding thick copper inner layers to carry more electrical current, soldering becomes more challenging than ever. This paper evaluates and presents critical design variables in thick, heavy copper Print Circuit Boards (PCB) that help to improve PTH hole-fill for lead-free wave soldering process.

Key Words: 

Thick Cu, lead-free, through-hole component, wave soldering, process optimization, SnAgCu



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