Immersion Tin Surface Finish - Reviewing the Past and a Look to the FutureAuthors: Mustafa Oezkoek, Dipl.-Ing., Hubertus Mertens, and Maren Bruder
Company: Atotech Deutschland GmbH
Date Published: 9/28/2014 Conference: SMTA International
When time passed by those OEM´s and assemblers who changed from HASL to Immersion Silver were confronted with corrosion failures form the field (creep corrosion and silver migration). Furthermore solder joint reliability issues caused by champagne voids. Both impacts was leading to the situation that the Immersion Silver market nowadays is not much growing and even for the future more and more assemblers are changing either to OSP or Immersion Tin whereas other OEMs still keep Immersion Silver as a surface finish by doing additional efforts like more properly sealing the electronics from the environment e.g. better sealed housing or by improved conformal coatings. It was not considered by some OEMs that their products are losing the corrosion resistance of the full assembled package when changing from HASL towards Immersion Silver. Immersion Tin did not suffer this problem because of the good corrosion resistance comparable to the HASL finish. Further developments of the Immersion Tin process such as continuous chemistry regeneration, the improvement of soldermask compatibility and other features lead to the fact that nowadays Immersion Tin is growing year by year. This paper will also provide an outlook to the future of Immersion Tin.
Immersion Tin, Surface Finish, Immersion Sn
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