Fundamental Study on a Secure Printing Process Using Nanowork Stencils for 01005 ComponentsAuthors: Stefan Härter, Jörg Franke, and Carmina Läntzsch
Company: Friedrich-Alexander University Erlangen-Nürnberg (FAU) and LaserJob GmbH
Date Published: 9/28/2014 Conference: SMTA International
For this study, a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection technology. In previous investigations on the printing process, the solder paste types were identified as a major effect, therefore different solder paste materials will be evaluated. Various stencil foil thicknesses and aperture geometries are employed and studied. The alloy of the solder paste is a lead-free tin/silver/copper (SAC305) of type 4 as well as type 5. The stencils for the study are laser-cutted, nano-coated and optimized for small aperture geometries and aspect ratios. Aims of the experiments are findings on process windows for components of the size 01005 for a secure printing process. To give an outlook the results will be adapted for even smaller passive components as the component size of 03015mm and 008004, respectively.
stencil printing, nano-coating, nanowork, transfer efficiency, area ratio, 01005, 03015mm, solder paste inspection, SPI
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