The Next Big Challenge for Stencil Printing - Sub 0.5 Area Ratio AperturesAuthors: Mark Whitmore and Clive Ashmore
Company: DEK Printing Solutions, ASM Assembly Systems
Date Published: 9/28/2014 Conference: SMTA International
This problem however is not exclusive to the mobile communications market. Nearly all major market segments are now experiencing a demand for an increasing range of components – just on a different scale. The underlying issue again falls back to aperture area ratio limitations in the stencil printing process.
If we are to extend the capabilities of the electronic assembly process for the increasing mix of components being experienced in the major markets today, then it is clear that existing stencil printing area ratio rules need to be pushed and broken.
This paper considers the results of two independent experiments conducted to investigate the possibilities of printing with sub 0.5 area ratio stencil apertures. The first experiment concerns a 100 micron (4mil) thick stencil application for the mobile communication market, whilst the second investigates sub 0.5 area ratio capabilities with a 127 micron (5mil) thick stencil aimed at Automotive and Industrial applications.
Printing, stencil, aperture, area ratio, heterogeneous, fine pitch, transfer efficiency
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