Understencil Video Effects to Study Solder Paste Transfer and Wiping Effects
Authors: Mike Bixenman, D.B.A., Wayne Raney, Chrys Shea, and Ray Whittier Company: Kyzen Corporation, Shea Engineering Services, and Vicor Corporation Date Published: 9/28/2014
Abstract: Market forces demand intelligent systems for monitoring and communicating, virtual connectivity and access to information everywhere in the world. To make these forces possible, system level trends require continued miniaturization, performance, reliability and properly formed attachments. Smaller features reduce the PCB assembly process window. To improve solder paste print performance and better understand the behavior of flux-stencil interactions, visualizing solder paste release from the aperture wall and on the seating surface of the stencil is critically important. The purpose of this research study is to use video images of the top side of the stencil to understand the value of wiping, nanoscale flux repellent coatings and solvent cleaning.