Advances in Fine Pitch Printing Process TechnologyAuthor: Isaiah Smith
Company: Speedline Technologies, Inc.
Date Published: 9/28/2014 Conference: SMTA International
Thinner stencils, smaller particle size solder paste, and smaller apertures, whereby even aperture shape becomes a factor in volume fill, test the limits of the successful printing process. Achieving sufficient or acceptable paste volume fill of fine-feature apertures has become an issue. Printing machine technology continues to advance to meet the fine-pitch challenge, with greater precision and motion control, closed-loop feedback systems, enclosed media printing, enhanced software tools and machine vision assists, and many other developments and innovations designed to enable successful and repeatable fine pitch solder paste printing for high-density SMT assemblies. This paper details those developments, and illustrates how they are contributing to process improvement through comparative test results.
printing, fine pitch, aperture, stencil
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