QFN Design Considerations to Improve Cleaning a Follow On StudyAuthors: Mike Bixenman, D.B.A., Dale Lee, Bill Vuono, and Steve Stach
Company: Kyzen Corporation, Plexus Corporation, TriQuint Semiconductor, and Austin American Technology
Date Published: 9/28/2014 Conference: SMTA International
The 2013 research paper studied different ground pad designs with the addition of via holes within the ground pad penetrating to the back side of the board. The via holes allowed flux volatile ingredients to outgas and escape during reflow and for some of the flux residue to drain to the back side of the board. The level of flux residue under the bottom termination reduced upwards to 80% less residue within the streets and around pads.
The purpose of the follow on research is to place non-plated via holes within the QFN streets four quadrants. Learning from the 2013 research data findings, the research hypothesis for this study predicts that the non-plated via holes will allow to air to penetrate and exhaust during reflow resulting in less residue under the bottom termination. The major benefit is that less residue prevents flux bridging. With an open flow channel under the component, cleaning fluids penetrate at a faster rate, which allows for reduced cleaning time and more consistent cleaning.
QFN, MLF, LPCC, QLP, HVQFN, LCC, Electronic Assembly Cleaning, Flux Residue, Electrochemical Migration
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