NEW HIGH THERMAL CONDUCTIVITY MATERIALS FOR THERMAL MANAGEMENT OF SURFACE MOUNT ELECTRONIC ASSEMBLIESAuthor: Steve Dunford
Company: Raytheon TI Systems
Date Published: 8/23/1998 Conference: Surface Mount International
The new materials are compared with existing ones and the benefits of application are described. High conductivity, reduced density, improved processing and flexibility are some of the other benefits discussed. Estimated costs for the new material demonstrate affordability and are also included.
Keywords: Thermal management, metal matrix composites, thermal conductivity
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