Surface Mount International Conference Proceedings


NEW HIGH THERMAL CONDUCTIVITY MATERIALS FOR THERMAL MANAGEMENT OF SURFACE MOUNT ELECTRONIC ASSEMBLIES

Author: Steve Dunford
Company: Raytheon TI Systems
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: High watt density requirements in surface mount applications and increased cost competition demands improved thermal management materials at an affordable cost. Several new products were investigated to determine their properties for possible application in surface mount applications. A thermal conductivity test fixture was set up and verified with samples of known materials before testing the new materials. Compatibility with standard multilayer board construction was verified and mechanical testing conducted on the materials. Material construction is described along with test procedures, and results.

The new materials are compared with existing ones and the benefits of application are described. High conductivity, reduced density, improved processing and flexibility are some of the other benefits discussed. Estimated costs for the new material demonstrate affordability and are also included.

Keywords: Thermal management, metal matrix composites, thermal conductivity



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