Study of Precise Micro-Dispensing for Adhesive Deposition
Authors: Xudong Chen, Jacob Denkins and Kenneth Church Company: nScrypt, Inc. Date Published: 9/28/2014
Abstract: Adhesive dispensing has been widely used in the electronic industry for decades. Recently the demand for smaller size & volume coupled with precision and flexibility of adhesive placement is increasing due to the advancement of miniaturized electronic components and devices. New adhesives are needed to meet the desired bonding requirement given reduced volume. Sometimes high viscosity adhesives are used since they have the advantage of holding the feature shape after dispensing which allows smaller feature sizes without sacrificing the volume needed for the bonding. Dispensing adhesives is not challenging, but doing this with sub nanoliter or picoliter level with good precision is not trivial. This paper presents a robust micro-dispensing solution for adhesives and polymers with 100 picoliter volume control. The unique valve and nozzle tip design provide exceptional control of medium and high viscosity materials and including materials with particle loading. A standard industrial adhesive for flip chip applications was used for this study. The short & long term repeatability of these printed features as well as the robustness of the wetted parts were demonstrated.