SMTA International Conference Proceedings

To Kill a Circuit Board: Perils in Manual Soldering and Cleaning Processes

Author: Cheryl Tulkoff
Company: DfR Solutions
Date Published: 9/28/2014   Conference: SMTA International

Abstract: Manual soldering and cleaning processes are among the least controlled processes in printed circuit board assembly. As a result, they create special challenges to both quality and long term reliability. This paper describes some of those key challenges and provides ways to address them in assembly to minimize problems. The topics to be covered include: - Design Considerations - General Manual Soldering Recommendations - Material Selection and Qualification Criteria - Cleaning Recommendations - Process Monitoring and Control - Relevant Industry Standards - Case Study

Through awareness of the issues, proper design and appropriate material selection and process control, companies can successfully use manual soldering and cleaning processes in high reliability products. Without proper planning, however, these processes can lead to a path of ruin.

Key Words: 

manual soldering, hand soldering, manual cleaning, spot cleaning

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819