SMTA International Conference Proceedings

Cleaning Process Efficiency and the Influence of Static & Dynamic Cleaning Rates

Authors: Umut Tosun, M.S.Ch.E. and Axel Vargas
Company: ZESTRON Americas
Date Published: 9/28/2014   Conference: SMTA International

Abstract: In order to meet the quality and reliability standards they desire, electronics manufacturers embark on a mission to identify the optimum cleaning process. This includes evaluating equipment types and options available, as well the cleaning agent alternatives. Whether the manufacturing process includes RMA, No-Clean fluxes, or water soluble fluxes, removing the residues requires an engineered aqueous based cleaning solution. Typically, selecting the ideal cleaning process involves creating an experimental study, producing test assemblies, and executing the evaluation either at an equipment or material supplier location or the electronics manufacturer production facility, provided that the selected equipment is available and accessible.

Speed and efficiency of the cleaning process is critical to the manufacturer’s operation and this is directly related to the cleaning rate of the system. The process cleaning rate is impacted by both the static and dynamic cleaning rate. The SCR (Static Cleaning Rate) is related to the ability of the cleaning agent to solubilize the residues whereas the DCR (Dynamic Cleaning Rate) is related to the effectiveness of mechanical energy imparted by the cleaning system in order to remove the solubilized residues. Is there a real correlation of the static cleaning rate to the dynamic cleaning rate?

This study presents the results of an experimental study the authors created to explore this relationship. Utilizing bare and populated test vehicles with RMA solder paste, they established the optimum cleaning agent parameters for the static cleaning rate for two cleaning agents. Employing these results, they identified the equipment operating parameters required to optimize not only the dynamic cleaning rate, but overall cleaning process performance. Results of all tests are presented, including conclusions drawn regarding any correlation between the static and dynamic cleaning rate, as well as an analytic approach to employing SCR and DCR to select the optimum cleaning agent.

Key Words: 

Static Cleaning Rate, Dynamic Cleaning Rate, Cleaning Agent, Cleaning Process Optimization

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