SMTA International Conference Proceedings

The Effect of Thermal Profiles on Cleanliness and Electrical Performance

Author: Eric Camden
Company: Foresite, Inc
Date Published: 9/28/2014   Conference: SMTA International

Abstract: A proper reflow soldering profile is a key parameter in rendering no-clean flux residues benign which improves electrical performance and overall reliability. The level of remaining active flux residues can be directly tied to reliability of the assemblies in a normal field service environment. Another key factor the profile plays a major role in is the electrical performance during surface insulation resistance testing commonly used for initial material and process acceptance testing. This paper will demonstrate the different levels of active flux residues after multiple thermal profile variations. It will also discuss proper equipment selection and best practices for selecting locations to place thermocouples for best solder quality and fully complexed flux residues.

Key Words: 

Reliability, electrical leakage, thermal profile, electrochemical migration, dendrite, field failures

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