Surface Mount International Conference Proceedings


THE FUTURE OF VACUUM DISPENSING FOR CHIP SCALE PACKAGES

Author: Allen Duck
Company: Speedline Technologies
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: The Chip Scale Package (CSP) offers the size, weight, and performance advantages of a flip chip in a mechanically robust package, compatible with existing surface mount placement equipment. The BGA® by Tessera is a popular CSP licensed to over 15 companies worldwide. This article explores techniques used to dispense onto BGA®s such as die mounted on reel-to-reel tape, using a CAM/ALOT 3500 dispensing system with self-contained tape vacuum degassing (TVD) unit located downstream of the dispensing system. This system may reduce certain manufacturing costs and offer even higher throughput than current methods.



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