Reliable Soldering for High and Mixed Volume Selective Soldering ProcessesAuthor: Gerjan Diepstraten
Company: Vitronics Soltec B.V.
Date Published: 9/28/2014 Conference: SMTA International
Selective soldering is very effective method to solder the THT components. There are two mainstream selective solder applications: - Drag soldering (point to point) - Dip soldering (stamp)
Both applications have a dropjet flux device to apply very small amounts of flux on the areas that are soldered. Despite these small amounts the remaining flux residues might cause electro-migration if not de-activated completely during the assembly process. This drives engineers to implement different flux formulations to avoid claims. Special in the automotive applications there are examples in the field that bridges and corrosion are caused by the growth of dendrites due to flux residues in combination with temperature, humidity and a current. The solder joints can be much more reliable when an inert flux is used in combination with a controlled soldering process.
Selective soldering, reliability, flux
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