Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free SolderAuthors: P. Borgesen, Ph.D., E. Cotts, Ph.D., and I. Dutta
Company: Binghamton University, Washington State University
Date Published: 9/28/2014 Conference: SMTA International
A major systematic research effort has led to a quantitative understanding of the initial microstructure and its subsequent evolution, as well as the resulting deformation properties and damage evolution, in thermal and isothermal cycling. Constitutive relations were developed that predict the evolution of properties during thermal cycling and aging. Approaches to reliability testing and the interpretation of test results in terms of life in service will be outlined and discussed.
Pb-free, solder, reliability, constitutive relations
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