A Closed-Form Norris-Landzberg Solder Reliability ModelAuthors: Emad S. Al-Momani, Ph.D., Mohammad T. Khasawneh, Ph.D. and Bahgat Sammakia, Ph.D.
Company: Intel Corporation and Binghamton University
Date Published: 9/28/2014 Conference: SMTA International
This paper presents the transformation of the original NL model into a closed-form solder joint fatigue reliability model. The proposed model does not require actual thermal cycling testing as in the original model and its modification trials. Instead, the model uses package/PCB design attributes. This modification will eliminate the lengthy thermal cycling testing and will also enable acceleration between two different packages, which is not possible in the original NL model. If thermal cycling results are available, the proposed model can still be used to predict reliability under other thermal cycling condition as in the original NL model.
reliability, modeling, solder, accelerated thermal cycle (ATC)
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.