Process Sensitive Components Guideline – A Primer for the IndustryAuthors: Marie Cole, Mike Bixenman, David Geiger, Curtis Grosskopf, Michelle Lam, Michael Lauri, Holly-Dee Rubin, Thilo Sack, Laurence Schultz, James Wilcox
Company: IBM Corporation, Kyzen Corporation, Flextronics International, Alcatel-Lucent, Celestica Inc., HDP User Group
Date Published: 9/28/2014 Conference: SMTA International
To address some of these shortcomings, the High Density Packaging (HDP) User Group consortium has undertaken the publication of a Process Sensitive Components Industry Guideline Document. This Guideline includes information on component construction and temperature induced failure mechanisms to help contract manufacturers (CMs) and original equipment manufacturers (OEMs) optimize their processes associated with process sensitive components. The CMs will learn which components can be expected to have limitations and benefit from the documentation of best practices to know to adjust their processes accordingly. The OEMs will learn how they will need to develop business processes to manage component information obtained from their suppliers and supervise the assembly process development at their CMs. In addition, this Guideline document defines proper interpretation and usage of J-STD-020 and J-STD-075 to promote more widespread understanding and use of these industry standards.
This paper will provide highlights of the content of the PSC Guideline document to increase industry awareness and encourage education regarding process sensitive components throughout the supply chain.
temperature sensitive components, temperature
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