A.R.E.A - Component Level Testing of Thermal Interface MaterialsAuthors: Harry Schoeller, Ph.D. and Martin K. Anselm, Ph.D.
Company: Universal Instruments Corp.
Date Published: 9/28/2014 Conference: SMTA International
In an effort to provide more realistic thermal resistance measurements, a variable load component level test fixture was developed for measuring the thermal resistance of TIMs. The thermal resistances of 13 commercially available gap pads were measured at 10% and 30% compression. Additionally some of the more compliant gap pads were characterized at 50% or 60% compression. Thermal resistance measurements were compared to data published by the supplier. The microstructure of each gap pad was also studied in conjunction with thermal resistance measurements to help explain the thermal performance.
Thermal Interface Material, Thermal Resistance, Gap Pad
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